Achieving another wireless connectivity milestone, Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced the WiLink™ 8.0 product family: a collection of 45-nanometer single-chip solutions that integrate up to five different radios, and set the stage for next-generation mobile Wi-Fi®, GNSS, NFC, Bluetooth® and FM transmit/receive applications. The WiLink 8.0 architecture supports various combinations of these technologies, allowing for customized solutions to address the unique needs and price points of all mobile markets. Each chip variant comes in a compact WSP package that can be mounted directly on a PCB, and includes all required RF front ends, a complete power management system, and comprehensive coexistence mechanisms. At the system level, the five-radio WiLink 8.0 chip offers a 60 percent cost reduction, 45 percent decrease in size and 30 percent lower power consumption compared to traditional multi-chip offerings. Complete details: www.ti.com/wilink8.
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The MedTech Industry’s Premier Design Competition is now accepting entries. Proudly presented by UBM Canon and MD+DI, the Medical Design Excellence Awards program has provided market visibility to over 500 innovative MedTech products that are changing the face of healthcare today. The MDEA also celebrates the achievements of medical product manufacturers, their suppliers, and the many people behind the scenes—engineers, scientists, designers, and clinicians—who are responsible for these groundbreaking innovations.
To view Multimedia News Release, go to http://www.multivu.com/mnr/58607-2013-medical-design-excellence-awards-call-for-entries-medtech-mdea13
Tools are supposed to make normal life easier, at least that is how it should be. People with disabilities, however, are dependant on such tools in order to be able to live their lives in a normal way. Ten percent of the Germans live with a recognized disability - for these people - and for their families and carers - the fair RehaCare in Düsseldorf offers an array of already known devices - and some new ones are of course presented as well.
From checking email at the beach to tweeting a movie review at the box office, Americans do everything on the go. Now, to help them invest on the run and on their own terms, ShareBuilder from ING DIRECT USA today launched a free mobile application for iPhone® and Blackberry® devices, giving investors continued access to their brokerage accounts.
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/ingdirect/45096/
Summer should be about taking vacations and spending time with friends and family, not taking trips to the bank branch and waiting in line to speak to a teller. That’s why ING DIRECT USA, the nation’s largest direct bank, is encouraging its Customers to put their bank branch in their pocket with the launch of their enhanced mobile application for iPhone® and BlackBerry® devices.
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/ingdirect/45386/
Summer should be about taking vacations and spending time with friends and family, not taking trips to the bank branch and waiting in line to speak to a teller. That’s why ING DIRECT USA, the nation’s largest direct bank, is encouraging its Customers to put their bank branch in their pocket with the launch of their enhanced mobile application for iPhone® and BlackBerry® devices.
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/ingdirect/45386/
Mobile software developers now have an accessible, well-equipped open source development tool based on the high performance OMAP™ 4 platform in the form of PandaBoard. This new, low-cost board provides unprecedented access to the OMAP 4 applications processor platform from Texas Instruments Incorporated (TI), which is power- and performance-optimized for Smartphones and other mobile devices. A growing online community of Linux experts supports PandaBoard developers designing on various mobile open source software distributions such as Android, Angstrom, Chrome, MeeGo and Ubuntu.
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/pandaboard/39158/
Texas Instruments Incorporated (TI) (NYSE: TXN) today introduced the CC2567 device, the first wireless, single-chip solution that enables direct short-range communication between ultra low-power, ANT™+-enabled devices and commonly used mobile devices relying on Bluetooth® technology such as PCs, Smartphones and tablets. The industry’s first dual-mode device, the CC2567 requires 80 percent less board area than a design with two single-mode solutions (one ANT+, one Bluetooth), enables simultaneous operation over a shared antenna with built-in coexistence, and increases the wireless transmission range up to two times the distance of a single-mode ANT+ solution.
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Texas Instruments Incorporated (TI) (NYSE: TXN) announced today the next generation of its popular OMAP™ family: the OMAP 5 mobile applications platform, which is positioned to transform how mobile devices, such as Smartphones, tablets and other mobile form factors are used, making them even more valuable in our daily lives. More information on the OMAP 5 platform can be found here: www.ti.com/wbu_omap5_pr_lp.
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Qualcomm Incorporated (NASDAQ: QCOM), a leading developer and innovator of advanced wireless technologies, products and services, today announced that it will showcase some of the latest innovations and ideas that are enabling access, control and interaction with the digital world during the GSMA Mobile World Congress 2011 (Booth 8B53, Hall 8), Feb. 14-17 in Barcelona. The Company’s demonstrations will feature next-generation mobile technologies and services designed to drive today’s and the future’s most advanced mobile devices and experiences. Highlights of the exhibit include LTE Advanced, HSPA+ Advanced, augmented reality, devices based on the Snapdragon™ mobile computing platform, WiPower™ and the Internet of Everything Module (IEM) design for enabling the “Internet of Everything.”
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/qualcomm/48665/
Qualcomm Incorporated (NASDAQ: QCOM) today announced that its Snapdragon™ processors are enabling the latest and greatest multimedia experiences in today’s commercial mobile devices, including stereoscopic 3D (S3D) entertainment, 1080p 30fps HD video capture and playback, console-quality gaming and full web browsing with Adobe Flash 10. The newest member of the Snapdragon family, Qualcomm’s APQ8060 dual-CPU processor, powers the HP TouchPad, which HP introduced yesterday.
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/qualcomm/48634/
