Leading smartphone brand Vivo officially announced the launch of its V3 and V3Max smartphones at a product release conference in Mumbai, India on April 5.
• Faster Operation with 4GB RAM
• Fast charging of five minutes for two-hour music playback
• Refine metallic body with 7.55 to 7.58mm slim design
• Faster fingerprint unlocking
• Hi-Fi quality sound
• Super-fast Shots
Part of Vivo’s 2016 V Series, the V3 and V3Max have a stylish, all-metal case design that not only guarantees durability, but also makes the phones much slimmer -- only 7.55 to 7.58mm in thickness.
In addition to a stylish exterior the new smartphones aim to provide a more efficient, fluent and enjoyable video and audio experience with modern phone users around the world in mind.
The V3Max combines 4GB RAM with a Snapdragon Octa-Core CPU to boost stability and speed with performance 100% better than is predecessor. The camera takes a mere 0.7 seconds to start up and features PDAF technology to focus project in 0.1 seconds. Combining with the extra-large 5.5-inch screen the camera offers the best photo and video viewing experience.
To view the multimedia release go to:
http://www.multivu.com/players/English/7800151-vivo-v3max-smartphone/
Qualcomm Incorporated (NASDAQ: QCOM) today announced that its Snapdragon™ processors are enabling the latest and greatest multimedia experiences in today’s commercial mobile devices, including stereoscopic 3D (S3D) entertainment, 1080p 30fps HD video capture and playback, console-quality gaming and full web browsing with Adobe Flash 10. The newest member of the Snapdragon family, Qualcomm’s APQ8060 dual-CPU processor, powers the HP TouchPad, which HP introduced yesterday.
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/qualcomm/48634/
Qualcomm Incorporated (NASDAQ: QCOM), a leading developer and innovator of advanced wireless technologies, products and services, today announced that it will showcase some of the latest innovations and ideas that are enabling access, control and interaction with the digital world during the GSMA Mobile World Congress 2011 (Booth 8B53, Hall 8), Feb. 14-17 in Barcelona. The Company’s demonstrations will feature next-generation mobile technologies and services designed to drive today’s and the future’s most advanced mobile devices and experiences. Highlights of the exhibit include LTE Advanced, HSPA+ Advanced, augmented reality, devices based on the Snapdragon™ mobile computing platform, WiPower™ and the Internet of Everything Module (IEM) design for enabling the “Internet of Everything.”
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/qualcomm/48665/
