Today, HANNOVER MESSE was dedicated to young people, with the TectoYou youth careers initiative attracting more than 1,400 young men and women. TectoYou features a wealth of information on careers in engineering and technology plus guided tours of selected exhibition stands.
Despite continuing economic uncertainty in 2010, SPIE’s business held up well, and profitability improved for the fifth year running. The Group broke new ground in all of its markets and saw organic growth resume in France
With consolidated turnover up 0.7% year-on-year to €3.75 billion, annual business volume stabilised, underpinned by a balanced customer portfolio and good anticipation of sector trends, with growth in the healthcare and social housing sectors, sustained mobility in cities, demand for energy efficiency in services and manufacturing, the solar photovoltaic boom and the roll-out of broadband networks being just a few examples. In addition, SPIE further strengthened its excellent position in the energy markets.
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/prne/spie/48893/
As the leading corporate advocate for positive afterschool programs, JCPenney is increasing its support of FIRST® (For Inspiration and Recognition of Science and Technology) by sponsoring 500 high school teams nationwide as they compete in FIRST robotics competitions this spring.
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/jcpenney/48221/
Prominent leaders in the fields of chemical engineering, science, industry and academia convened today for a high-level panel discussion to examine solutions to the pressing issues of energy, safe food and water and human health, at the U.S. launch event for the International Year of Chemistry.
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/american-chemistry-council/48369/
Vehicle designs and colors change each year but it is the integration of consumer electronics technologies into the vehicle interior that is really fueling future driving experiences. Continental, one of the world’s largest automotive suppliers, is engineering hardware, software and systems that are powering the vehicle with an “Always On” connection and linking drivers and passengers to content and information in new ways. Continental will showcase some of its latest Interior innovations to its automotive customers and consumer electronics partners during the Consumer Electronics Show (CES) being held January 6-9 in Las Vegas, Nevada.
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/continentalag/46716/
McGraw-Hill Construction, Architectural Record and GreenSource today released video highlights from Innovation 2010, a conference on big and super-green buildings and cityscapes, held in New York City in October 2010. The video features sustainable projects from Dubai, Chicago, New York, Hamburg, Manitoba and South Korea.
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/mcgraw-hill/46846/
Presented here is the new EM Super-Jet Printing press, a two color printing press for envelopes with 6” cylinders and a multi purpose envelope feeder.
Vertex’s responsibility was the design and engineering of all plastic and sheet metal parts, as well as, exterior covers design and engineering driven by ergonomics and user interface with the press.
As part of the EM series Vertex Product Development Inc. was also responsible for the Jet EM printing press which is a two color printing press for envelopes with 3” cylinders and a Dual-Feeder option. The objectives in this effort was to use as many common parts as possible with the EM Super-Jet press to lower stock and minimize part numbers in the BOM (Bill of Material), as well as, to add new product to the EM press family.
This design of a unique non contact chuck, was a part of a much larger scale design and engineering project of a wet processing machine for the semiconductor industry.
The client requested Vertex to design, engineer and produce a scalable new chuck that can hold the wafer from the bottom end and at the same time process the same side which the wafer is held from. We had strict instructions not to have any contact with the top side of the wafer, due to sensitive semiconductor design on that side, therefore the name “Non Contact Chuck”.
This unique design had to overcome and avoid collision of the wafer’s holding fingers with the process module while scanning the wafer above it. This resulted in holding fingers behaving like Millipede legs.
Challenges in this design were enormous.
The chuck had to spin 360 degrees, travel on the Z axis, pressurize the top side of the wafer with air to prevent any liquid from getting to the top side, as well as, pneumatically control and actuate each finger at the right time.
Great project to work on, great challenge and great results.
In an effort to promote science, technology, engineering and mathematics (STEM) education, the U.S. Army announced today that it has named the 2010 eCYBERMISSION national first-place teams. Managed by the U.S. Army Research, Development and Engineering Command (RDECOM) at Aberdeen Proving Ground, Md., the eCYBERMISSION program awarded more than $1 million to students from across the nation and in Department of Defense Education Activity schools overseas.
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/ecybermission/44116/
