Ixonos has over 15 years of experience in mobile software development, working together with companies such as leading device manufacturers and helping them roll out winning devices one after the other. During Mobile World Congress on 27 February – 1 March in Barcelona, Spain, Ixonos introduces a productized service package based on this vast experience. Ixonos Mobile SW Services Suite™ is a collection of services that enables straightforward development of high-quality components ready to be integrated into customers’ wireless devices.
To view Multimedia News Release, go to http://www.multivu.com/mnr/53771-ixonos
Envision a wireless experience with maximum data rates and no dropped calls at cell edges. Envision limited service areas being a thing of the past. Envision lower costs and greener solutions for base stations. Now, envision the technology that makes all of this is possible. Texas Instruments Incorporated (TI) (NASDAQ: TXN) today is unveiling the industry’s most comprehensive wireless infrastructure System-on-Chip (SoC), featuring an ideal mix of processing elements for both ultra-high capacity small cell and macro base stations. TI’s scalable TMS320TCI6636 delivers breakthrough performance, simultaneous 3G and 4G coverage and capacity expansion features that wireless operators and their users will love. For more information please visit www.ti.com/multicore.
To view Multimedia News Release, go to http://www.multivu.com/mnr/54042-texas-instruments-ti-multi-standard-soc-ultra-high-capacity
Small business success is essential to overall U.S. economic success. Financial accomplishment in the small business sector requires the ability to control expense, maximize productivity and revenues, as well as keep customers happy. Mobile technology can help accomplish every one of these objectives.
Frost & Sullivan recently published a white paper, Mobile Solutions for Today’s Small Business: The Need for Affordable, Easy-to-Use Products and Support, which examines how mobile technology can help small business owners become more competitive, profitable and productive.
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/frostsullivan/54685
Achieving another wireless connectivity milestone, Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced the WiLink™ 8.0 product family: a collection of 45-nanometer single-chip solutions that integrate up to five different radios, and set the stage for next-generation mobile Wi-Fi®, GNSS, NFC, Bluetooth® and FM transmit/receive applications. The WiLink 8.0 architecture supports various combinations of these technologies, allowing for customized solutions to address the unique needs and price points of all mobile markets. Each chip variant comes in a compact WSP package that can be mounted directly on a PCB, and includes all required RF front ends, a complete power management system, and comprehensive coexistence mechanisms. At the system level, the five-radio WiLink 8.0 chip offers a 60 percent cost reduction, 45 percent decrease in size and 30 percent lower power consumption compared to traditional multi-chip offerings. Complete details: www.ti.com/wilink8.
To view Multimedia News Release, go to http://www.multivu.com/mnr/54040-texas-instruments-ti-wilink8-5-in-1-wireless-connectivity-next-gen-mobile
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Ruckus Wireless™ today announced that the Mandarin Oriental’s flagship North America property in New York has standardized on the Ruckus Wi-Fi wall switch to address explosive demand for IP-based services and wireless capacity.
To view Multimedia News Release, go to http://www.multivu.com/mnr/48552-ruckus-wireless-mandarin-oriental-new-york-hotel-wi-fi-wall-switch
Enterasys Networks, a Siemens Enterprise Communications Company, today announced its OneFabric Edge architecture, a purpose-built architecture for edge networking to support mobile application delivery. Built on the recently announced OneFabric architecture, OneFabric Edge unifies wired and wireless networks, enabling enterprises to predictably deliver high quality applications to mobile users at any scale, supporting “Bring Your Own Device” (BYOD) initiatives.
To view Multimedia News Release, go to http://www.multivu.com/mnr/54171-enterasys-onefabric-edge-enterprise-mobility
Building from more than a decade of proven leadership in the wireless connectivity space, Texas Instruments Incorporated (TI) (NASDAQ: TXN) today unveiled the SimpleLink™ product family, the industry’s widest portfolio of easy-to-use wireless connectivity technologies for low-power, low-cost embedded applications. The SimpleLink family includes self-contained wireless processors, aimed at enabling easy integration with any embedded system.
The cornerstone offering in this new family is the new SimpleLink Wi-Fi® CC3000 product: an easy-to-implement Wi-Fi solution that will lead the charge in expanding the world’s Internet of Things. The SimpleLink Wi-Fi CC3000 is a self-contained 802.11 network processor, making it ideal for simple and quick addition of Internet connectivity to any embedded application. For full details on the SimpleLink Wi-Fi CC3000 and all SimpleLink products, visit http://ti.com/simplelink.
To view Multimedia News Release, go to http://www.multivu.com/mnr/54039-texas-instruments-launches-product-family-simplelink-wi-fi-cc3000
Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced its latest innovation for 4G/LTE microwave backhaul, the BCM85620 system-on-a-chip (SoC). Designed specifically to address the need for higher bandwidth in mobile backhaul, the BCM85620 represents the industry’s first solution to deliver Gigabit bandwidth and beyond and is the first SoC to combine a baseband modem and network processor in one chip. Visit www.broadcom.com/ to learn more.
To view Multimedia News Release, go to http://www.multivu.com/mnr/52659-broadcom-delivers-industry-first-soc-achieve-4g-lte-microwave-backhaul
