Achieving another wireless connectivity milestone, Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced the WiLink™ 8.0 product family: a collection of 45-nanometer single-chip solutions that integrate up to five different radios, and set the stage for next-generation mobile Wi-Fi®, GNSS, NFC, Bluetooth® and FM transmit/receive applications. The WiLink 8.0 architecture supports various combinations of these technologies, allowing for customized solutions to address the unique needs and price points of all mobile markets. Each chip variant comes in a compact WSP package that can be mounted directly on a PCB, and includes all required RF front ends, a complete power management system, and comprehensive coexistence mechanisms. At the system level, the five-radio WiLink 8.0 chip offers a 60 percent cost reduction, 45 percent decrease in size and 30 percent lower power consumption compared to traditional multi-chip offerings. Complete details: www.ti.com/wilink8.
To view Multimedia News Release, go to http://www.multivu.com/mnr/54040-texas-instruments-ti-wilink8-5-in-1-wireless-connectivity-next-gen-mobile
Building from more than a decade of proven leadership in the wireless connectivity space, Texas Instruments Incorporated (TI) (NASDAQ: TXN) today unveiled the SimpleLink™ product family, the industry’s widest portfolio of easy-to-use wireless connectivity technologies for low-power, low-cost embedded applications. The SimpleLink family includes self-contained wireless processors, aimed at enabling easy integration with any embedded system.
The cornerstone offering in this new family is the new SimpleLink Wi-Fi® CC3000 product: an easy-to-implement Wi-Fi solution that will lead the charge in expanding the world’s Internet of Things. The SimpleLink Wi-Fi CC3000 is a self-contained 802.11 network processor, making it ideal for simple and quick addition of Internet connectivity to any embedded application. For full details on the SimpleLink Wi-Fi CC3000 and all SimpleLink products, visit http://ti.com/simplelink.
To view Multimedia News Release, go to http://www.multivu.com/mnr/54039-texas-instruments-launches-product-family-simplelink-wi-fi-cc3000
Imagine upgrading from ARM9™-based product designs to add 3D interactive touch screens, higher resolution displays, faster performance and multiple, flexible integrated connectivity options for a more robust offering — all while keeping design costs and power levels low. Visualize taking these new products to market in six months with an inexpensive development platform and free, complete software development kit. Texas Instruments Incorporated (NYSE: TXN) (TI) now makes this design vision a reality with its new Sitara™ AM335x ARM® Cortex™-A8 microprocessors .
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/texasinstruments/51795/
Are you ready to rock? It’s show time as Hasbro Inc.’s (NASDAQ: HAS) iconic PLAYSKOOL brand introduces the LET’S ROCK! ELMO interactive plush, the most innovative Elmo toy yet. Joined by music industry veteran and Grammy Award-winning producer Randy Jackson, LET’S ROCK! ELMO made his official debut at a private event yesterday at the Empire Hotel in New York, NY. Known for his ability to guide the next generation of music superstars into the spotlight, Jackson was on hand to offer advice as LET’S ROCK! ELMO takes the stage at retail this fall. The truly interactive LET’S ROCK! ELMO plush character sings, plays instruments, and invites little musicians to rock out with him!
To view Multimedia News Release, go to http://www.multivu.com/mnr/52202-randy-jackson-joins-hasbro-playskool-for-let-s-rock-elmo-launch
Designed to help developers obtain safety certifications, Texas Instruments Incorporated (TI) (NYSE: TXN) today announced its new Hercules safety microcontroller platform for medical, industrial and transportation applications. The platform consists of three ARM Cortex-based microcontroller families that deliver scalable performance, connectivity, memory and safety features for applications that require a high level of reliability. Unlike many microcontrollers that rely heavily on software for safety capabilities, Hercules microcontrollers implement safeguards in hardware to maximize performance and reduce software overhead. Coupled with robust tools, software and safety documentation, this functionality gives developers the headroom to differentiate their end products and speed time to market. For more information, visit www.ti.com/hercules-pr-lp.
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/texasinstruments/39162/
National Instruments (Nasdaq: NATI) today introduced a 14 GHz version of its NI PXIe-5665 high-performance RF vector signal analyzer (VSA), which delivers best-in-class dynamic range and accuracy in a cost-effective PXI form factor. The new VSA features industry-leading phase noise and dynamic range, regardless of form factor, including traditional rack-and-stack instruments. Because of its PXI platform, the VSA can deliver measurement speeds up to 20 times faster than box instruments and for less cost. Additionally, it takes advantage of multicore computing architectures and parallel programming capabilities through NI LabVIEW system design software. It also offers peer-to-peer data streaming for signal processing and a flexible multiple input, multiple output (MIMO) architecture for phase-coherent measurements. Such features make it ideal for demanding RF test applications including radio detection and ranging (RADAR), satellite, radio and harmonic testing.
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/nationalinstruments/51200/
Texas Instruments Incorporated (NYSE: TXN) (TI) today unveiled the TMS320TCI6612 and TMS320TCI6614, the industry’s most comprehensive System-on-Chips (SoCs) for developers of metro, pico and enterprise small cell base stations. TI’s new small cell SoCs are enabled with production ready software and are the highest performing devices available for small cells. Based on TI’s innovative KeyStone multicore architecture, these scalable SoCs encompass a mix of processing elements including radio accelerators, network and security coprocessors, combined fixed-and floating-point digital signal processors (DSPs) and an ARM® RISC processor, providing the ideal foundation for layers 1, 2 and 3 and transport processing for high performance small cell base stations.
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/texasinstruments/39165/
Texas Instruments Incorporated (TI) (NYSE: TXN) today announced delivery of a mobile-grade, battery-optimized Wi-Fi solution to the open source Linux community as part of the OpenLink™ project, focused on providing a wide range of wireless connectivity solutions for native Linux. Customers and developers targeting battery-powered Wi-Fi products can now use TI’s OpenLink drivers, gaining native kernel benefits such as tested technologies, faster time-to-market, and simplified re-integration when upgrading from one kernel version to the next. In addition to Wi-Fi, the OpenLink project includes native Linux solutions for Bluetooth® and FM technologies, and will expand to support other technologies such as ANT, Bluetooth Low Energy and ZigBee®. TI will also introduce additional low-power features to the kernel when possible. Visit www.openlink.org for source code, development projects, community support and more.
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/texasinstruments/39163/
Texas Instruments Incorporated (TI) (NYSE: TXN) announced today the next generation of its popular OMAP™ family: the OMAP 5 mobile applications platform, which is positioned to transform how mobile devices, such as Smartphones, tablets and other mobile form factors are used, making them even more valuable in our daily lives. More information on the OMAP 5 platform can be found here: www.ti.com/wbu_omap5_pr_lp.
To view Multimedia News release, go to http://multivu.prnewswire.com/mnr/texasinstruments/39161/
Texas Instruments Incorporated (TI) (NYSE: TXN) today introduced the CC2567 device, the first wireless, single-chip solution that enables direct short-range communication between ultra low-power, ANT™+-enabled devices and commonly used mobile devices relying on Bluetooth® technology such as PCs, Smartphones and tablets. The industry’s first dual-mode device, the CC2567 requires 80 percent less board area than a design with two single-mode solutions (one ANT+, one Bluetooth), enables simultaneous operation over a shared antenna with built-in coexistence, and increases the wireless transmission range up to two times the distance of a single-mode ANT+ solution.
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/texasinstruments/39160/
