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There’s a lot more to Hollywood magic than smoke and mirrors – popular movie and TV shows about zombies, superheroes, spaceships and true crime only come to life because of science, technology, engineering and math (STEM). That’s why Texas Instruments (TI) is launching “STEM Behind Hollywood,” an exciting new education program developed with assistance from The Science & Entertainment Exchange, a program of the National Academy of Sciences, as well as actress, neuroscientist and STEM education advocate Mayim Bialik. To view Multimedia News Release, go to http://www.multivu.com/mnr/54048-texas-instruments-stem-behind-hollywood-program-with-mayim-bialik

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With BeagleBone Black, the next-generation offering from BeagleBoard.org, everyone from electronic artists to engineers has access to a ready-to-use, 1-GHz computer for only $45. This credit-card-sized, Linux computer is an open hardware and software development platform that makes it quick and easy to transform great ideas into products. BeagleBone Black allows developers to leverage the ideas and knowledge of the highly active and engaged users of the BeagleBoard.org community who support each other from concept through development. Opportunities for innovation are endless. To view Multimedia News Release, go to http://www.multivu.com/mnr/54046-beaglebone-black-open-source-1-ghz-linux-computer

Texas Instruments (TI), the most trusted brand in graphing calculator technology, “took a major step forward in our mission to improve student understanding and achievement in mathematics” with the release today of two new innovative apps: TI-Nspire™ App for iPad and TI-Nspire™ CAS App for iPad, said Melendy Lovett, president of Texas Instruments Education Technology. To view Multimedia News Release, go to http://www.multivu.com/mnr/54045-texas-instruments-unveils-breakthrough-ti-nspire-apps-for-ipad

http://www.slam-​n-​ropes.com -​ Im­mor­tal Mar­tial Arts Inc. was the orig­i­nal man­u­fac­tur­er and dis­trib­u­tor of the Bat­tling Ropes® brand. Af­ter six years of sup­ply­ing heavy train­ing ropes for John Brook­field Im­mor­tal de­cid­ed to launch their own new and im­proved patent pend­ing brand of heavy train­ing ropes called Slam N ropes®. All of our ropes are made of com­mer­cial qual­i­ty ma­te­ri­als specif­i­cal­ly de­signed for rope waves, slams and un­du­la­tion ex­er­cis­es. SLAM N ROPES® BRAND THE NEED FOR A BET­TER ROPE: Af­ter much tri­al and er­ror and prod­uct re-​de­sign and many thou­sands of dol­lars lat­er, we came up with the best com­mer­cial qual­i­ty and most func­tion­al de­sign of heavy train­ing ropes in the in­dus­try. We are con­vinced about the qual­i­ty, dura­bil­i­ty and unique de­sign of our prod­ucts com­pared to what's cur­rent­ly avail­able that we have filed a full util­i­ty patent for our de­signs with the US Patent & Trade­mark of­fice. In ad­di­tion in 2012 Im­mor­tal re­ceived a reg­is­tered trade mark cer­ti­fi­ca­tion by the USP­TO for Slam N Ropes®.

Patrick Henry Bilim ve Sanat okulu öğrencilerin gözüyle evrim nasıl gerçekleştiği güzel bir animasyon ile izleyebilirsiniz.

To most technologists, cloud computing is about applications, servers, storage and connectivity. To Texas Instruments Incorporated (TI) (NASDAQ: TXN) it means much more. Today, TI is unveiling a BETTER way to cloud with six new multicore System-on-Chips (SoCs). Based on its award winning KeyStone architecture, TI’s SoCs are designed to revitalize cloud computing, inject new verve and excitement into pivotal infrastructure systems and, despite their feature rich specifications and superior performance, actually reduce energy consumption. To view Multimedia News Release, go to http://www.multivu.com/mnr/54044-texas-instruments-keystone-multicore-socs-revitalize-cloud-applications

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Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced TI Silicon Valley Labs, its research center for innovation in analog and mixed signal electronics. The labs’ charter is to conduct advanced research and development in analog and mixed signal circuits and technologies through recruitment of top talent and close collaboration with universities and customers. Watch a video about TI Silicon Valley Labs at http://www.ti.com/analogresearch-prv. To view Multimedia News Release, go to http://www.multivu.com/mnr/54043-texas-instruments-ti-silicon-valley-labs-analog-mixed-signal-electronics

Envision a wireless experience with maximum data rates and no dropped calls at cell edges. Envision limited service areas being a thing of the past. Envision lower costs and greener solutions for base stations. Now, envision the technology that makes all of this is possible. Texas Instruments Incorporated (TI) (NASDAQ: TXN) today is unveiling the industry’s most comprehensive wireless infrastructure System-on-Chip (SoC), featuring an ideal mix of processing elements for both ultra-high capacity small cell and macro base stations. TI’s scalable TMS320TCI6636 delivers breakthrough performance, simultaneous 3G and 4G coverage and capacity expansion features that wireless operators and their users will love. For more information please visit www.ti.com/multicore. To view Multimedia News Release, go to http://www.multivu.com/mnr/54042-texas-instruments-ti-multi-standard-soc-ultra-high-capacity

Achieving another wireless connectivity milestone, Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced the WiLink™ 8.0 product family: a collection of 45-nanometer single-chip solutions that integrate up to five different radios, and set the stage for next-generation mobile Wi-Fi®, GNSS, NFC, Bluetooth® and FM transmit/receive applications. The WiLink 8.0 architecture supports various combinations of these technologies, allowing for customized solutions to address the unique needs and price points of all mobile markets. Each chip variant comes in a compact WSP package that can be mounted directly on a PCB, and includes all required RF front ends, a complete power management system, and comprehensive coexistence mechanisms. At the system level, the five-radio WiLink 8.0 chip offers a 60 percent cost reduction, 45 percent decrease in size and 30 percent lower power consumption compared to traditional multi-chip offerings. Complete details: www.ti.com/wilink8. To view Multimedia News Release, go to http://www.multivu.com/mnr/54040-texas-instruments-ti-wilink8-5-in-1-wireless-connectivity-next-gen-mobile