EUROPEAN MICROWAVE WEEK - Peregrine Semiconductor Corp. (NASDAQ: PSMI), founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, announces the expansion of its integrated product portfolio into DC and X-band frequencies. Today, Peregrine introduces two new integrated products–a True DC switch and an X-band core chip. Built on Peregrine's UltraCMOS® technology, both products integrate RF, digital and analog components onto a single chip. While integration has traditionally offered high-volume markets the benefit of lower cost, Peregrine uses intelligent integration to offer performance advantages in high-performance markets. Peregrine's integrated products offer benefits such as configurability, flexibility, reliability, repeatability, ease-of-use, a reduced form factor and enhanced performance.
To view the Multimedia News Release, go to http://www.multivu.com/players/English/7311051-peregrine-semiconductor-expands-integrated-product-portfolio/
Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced its latest innovation for 4G/LTE microwave backhaul, the BCM85620 system-on-a-chip (SoC). Designed specifically to address the need for higher bandwidth in mobile backhaul, the BCM85620 represents the industry’s first solution to deliver Gigabit bandwidth and beyond and is the first SoC to combine a baseband modem and network processor in one chip. Visit www.broadcom.com/ to learn more.
To view Multimedia News Release, go to http://www.multivu.com/mnr/52659-broadcom-delivers-industry-first-soc-achieve-4g-lte-microwave-backhaul
Presented here is an extensive product design and engineering effort, from the ground up of a Semiconductor Wet Processing System. This new system is capable of fully automated, cassette-to-cassette, true single-sided wet processing of 1-12\
This design of a unique non contact chuck, was a part of a much larger scale design and engineering project of a wet processing machine for the semiconductor industry.
The client requested Vertex to design, engineer and produce a scalable new chuck that can hold the wafer from the bottom end and at the same time process the same side which the wafer is held from. We had strict instructions not to have any contact with the top side of the wafer, due to sensitive semiconductor design on that side, therefore the name “Non Contact Chuck”.
This unique design had to overcome and avoid collision of the wafer’s holding fingers with the process module while scanning the wafer above it. This resulted in holding fingers behaving like Millipede legs.
Challenges in this design were enormous.
The chuck had to spin 360 degrees, travel on the Z axis, pressurize the top side of the wafer with air to prevent any liquid from getting to the top side, as well as, pneumatically control and actuate each finger at the right time.
Great project to work on, great challenge and great results.
